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Layers

1-32layers

Materials

CEM1,CEM3,Teflon,Rogers,FR-4,High Tg FR-4,Aluminum Base,Halogen Free

Max. Board Size

510*1200mm

Material

RoHS Directive-compliant

PCB thickness

1.6 ±0.1mm

Out Layer Copper Thickness

1-6oz

Inner Layer Copper Thickness

1/2oz-5oz

Max. board Thickness

6.0mm

Minimum hole size

0.20mm

Minimum line width/space

3/3mil

Min. S/M Pitch

0.1mm(4mil)

Plate thickness and aperture ratio

30:1

Minimum hole copper

20µm

Hole dia. Tolerance(PTH)

±0.075mm(3mil)

Hole dia. Tolerance(NPTH)

±0.05mm (2mil)

Hole position deviation

±0.05mm (2mil)

Outline tolerance

±0.05mm (2mil)

Surface finished

HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver

Solder mask

green

Legend

white

Outline

rout and score/V-cut

E-test

100%

Inspection standard

IPC-A-600H/IPC-6012B, Class 2

Outgoing reports

final inspection, E-test, solderability test, micro section and more

Certificates

UL (E315391), ISO 14001, TS16949, ISO 9001, SGS

  • Electronic components material purchasing
  • Bare PCB fabrication
  • PCB Assembly Service. (SMT, BGA, DIP)
  • FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT)
  • Cable, Wire-harness assembly,sheet metal,Electrical cabinet Assembly service
  • Conformal coating service
  • Prototyping and mass production...
  • PCB layout, PCBA design according to your idea
  • PCBA copy/clone
  • Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design
  • Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming
  • Embedded User Interface Design / lSystem Hardware Design...
  • 1.Evaluation of customer requirements
  • 2.Design for Testability (DFT)
  • 3.Design for Excellence (DFX)  Analysis
  • 4.Virtual Prototyping-Valor Software
  • 5.Testability guidelines provided
  • 6.Functional Testing & Development
  • 7.In-Circuit Testing & Development
  • 8.Dynamic burn-in with full temperature cycling
  • 9.Troubleshoot to component level
  • 10.Engineering Services

XinDaChang'S Materials Management program offers our customers JIT ( just-in-time) delivery to accommodate product shipments to attain Time-to-Market requirements:
1.Full MRP System
2.VMI (Vendor Managed Inventory)
3.Limited Receiving & Inspection
4.Computerized Tracking & Material Status
5.Dashboard Solutions
6.Auto Replenishment program
7.100% Inspection to customer's AVL (Approved Vendor List)
8.FIFO (First-in/ First-out)
9.Weekly Rolling Build Forecast to Suppliers

As an industry leader in supply-chain facilitation,XinDaChang delivers customers the broadest and most comprehensive solutions to leverage total business volume with strategic suppliers:
1.SQM (Supplier Quality Management)
2.Supplier Performance Improvement System
3.Supplier Replenishment Program
4.Drive Quality Back to Suppliers
5.Dock-to-Dock with Suppliers

  • PCB layout, PCBA design according to your idea
  • PCBA copy/clone
  • Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design
  • Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming
  • Embedded User Interface Design / lSystem Hardware Design...

FOB Port

 Shenzhen

Weight per Unit

0.8 Kilograms

HTS Code

8534.00.90 00

Export Carton Dimensions L/W/H

58.0 x 58.0 x 1.8 Centimeters

Lead Time

15–20 days

Dimensions per Unit

25.0 x 20.0 x 0.6 Centimeters

Units per Export Carton

40.0

Export Carton Weight

2.0 Kilograms

 

Q1. What is needed for quotation?

A: PCB : Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)
PCBA: PCB information, BOM, (Testing documents...)

Q2. What file formats do you accept for production?

A: Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)

Q3. Are my files safe?

A: Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third parties.

Q4. MOQ?

A: There is no MOQ. We are able to handle Small as well as large volume production with flexibility.

Q5. Shipping cost?

A: The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.

Q6. Do you accept process materials supplied by clients?

A: Yes, we can provide component source, and we also accept component from client.


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