Intelligent control board design pcb&pcba manufacture

Product Detail

SMT assembly including BGA assembly
Accepted SMD chips	01005, BGA, QFP, QFN, TSOP
Component height	0.2-25mm
Min packing	0201
Min distance among BGA	0.25-2.0mm
Min BGA size	0.1-0.63mm
Min QFP space	0.35mm
Min assembly size	(XY) 5030mm
Max assembly size	(XY) 350550mm
Pick-placement precision	±0.01mm
Placement capability	0805, 0603, 0402, 0201
High pin count press fit available
SMT capacity per day	2,000,000 point

Strict product liability, taking IPC-A-160 standard
Engineering pretreatment before production
Production process control
100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
100% AOI inspection, including X-ray, 3D microscope and ICT
High-voltage test, impedance control test
Micro section, soldering capacity, thermal stress test, shocking test
No minimum order quantity request
Quick and on-time delivery
ISO 9001:2015,ISO13485:2016 ,SGS certified and RoHS Directive-compliant Certificated
High-performance Samsung & JUKI SMT machines
High-precision 0201 size components SMT technology
Materials/components are from original manufacturers,Reliable components sourcing channels (strategic cooperation with arrow and AV net, strict supplier audit system)
Professional engineering staff to provide technical support
High/maximum and low/medium volume accepted
Sign NDA with partners to keep our partner's technical confidential

Material sourcing-IQC-stock-material to SMT-SMT line loading-solder paste/glue printing-chip mount-reflow-100% visual inspection-automated optical inspection (AOI)-SMT QC sampling-SMT stock-material to PTH-PTH line loading-plated through hole-wave soldering -touch up-100% visual inspection-PTH QC sampling-in-circuit test (ICT)-final assembly-functional test (FCT)-packing-OQC sampling-shipping

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