|
Quality Grade |
•Standard IPC 2-3 |
|
Assembly Technology |
• SMD Stencils •PCB Fabrication • SMT PCB Assembly • THT assembly • Cable and Wire Harness Assembly • Conformal Coating • User Interface Assemblies • Box Build Assembly • Finalproduct assembly |
|
Value Added Services |
• Component Sourcing • Packing and delivery • DFM • Packing and delivery • PCBA sample • Rework • IC Programming • NPI Report |
|
Company Certifications |
• ISO9001 • IATF16949 • ISO13485 • 14001 |
|
Product Certifications |
• UL • RoHS • SGS • REACH |
|
Order Capacity |
• No requirements of MOQ (Minimum Order Quantity) |
|
Testing Process |
QC manual inspection SPI（Solder Paste Inspection） X-ray • FAI (first article inspection) ICT FCT Aging test Reliability test |
|
FOB Port |
Shenzhen |
|
Weight per Unit |
150.0 Grams |
|
HTS Code |
3824.99.70 00 |
|
Export Carton Dimensions L/W/H |
53.0 x 29.0 x 37.0 Centimeters |
|
Lead Time |
14–21 days |
|
Dimensions per Unit |
15.0 x 10.0 x 3.0 Centimeters |
|
Units per Export Carton |
100.0 |
|
Export Carton Weight |
13.0 Kilograms |