PCBA for sensor production

FOB Port	China (Mainland)
Lead Time	7–15 days

 

• SMT assembly
• 2 sets high-speed SMT machine
• 2 sets automatic printers with fiduciary alignment
• 2 sets ICT test machines
• THT assembly
• 2 sets of wave soldering machine lines
• 1 set of automatic component inserter: IST-4000

• ISO 9001:2008
• UL certification
• IPC-610D/E, class II compliance
• ICT, AOI, functional test
• Stock control under ERP system

• 1) SMT assembly including BGA assembly
• 2) Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP
• 3)Component height: 0.2-25mm
• 4)Min packing: 0201
• 5) Min distance among BGA: 0.25-2.0mm
• 6)Min BGA size: 0.1-0.63mm
• 7)Min QFP space: 0.35mm
• 8) Min assembly size: (X) 50 * (Y) 30mm
• 9)Max assembly size: (X): 350 * (Y) 550mm
• 10) Pick-placement precision: ±0.01mm
• 11) Placement capability: 0805, 0603, 0402, 0201
• 12) High-pin count press fit available
• 13)SMT capacity per day: 800,000 points

• 1) Strict product liability, taking IPC-A-160 standard
• 2)Engineering pretreatment before production
• 3) Production process control (5ms)
• 4) 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 5) 100% AOI inspection, including X-ray, 3D microscope and ICT
• 6) High-voltage test, impedance control test
• 7)Microsection, soldering capacity, thermal stress test, shocking test
• 8)In-house PCB production
• 9) No minimum order quantity and free sample
• 10) Focus on low to medium volume production
• 11)Quick and on-time delivery